• DocumentCode
    1017803
  • Title

    Optimal numerical design of forced convection heat sinks

  • Author

    Krueger, William B. ; Bar-Cohen, Avram

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Minnesota, Twin Cities, MN, USA
  • Volume
    27
  • Issue
    2
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    417
  • Lastpage
    425
  • Abstract
    The objective of this paper is to describe the development of a computationally efficient computer-aided design (CAD) method, which uses a finite element numerical model (FEM) coupled with empirical correlations, to create an optimum heat sink design, subject to multiple constraints. A thermal optimization "challenge" problem, representative of anticipated heat sink requirements in the near future, is solved to demonstrate the proposed methodology. Particular emphasis is placed upon micro-processor central processing unit (CPU) chip cooling applications where, in addition to thermal requirements, the heat sink design specification includes constraints upon size, total mass, and air coolant pressure drop across the heat sink.
  • Keywords
    automation; constraint handling; cooling; electronic design automation; finite element analysis; heat sinks; microprocessor chips; optimisation; thermal management (packaging); CAD; CPU; air coolant pressure drop; automated design; central processing unit; chip cooling applications; computational efficiency; computer-aided design; design methodology; empirical correlation; finite element numerical; forced convection heat sink; heat sink requirements; microprocessor chip; optimal numerical design; optimum heat sink design; size constraints; thermal management; thermal optimization; total mass constraint; Central Processing Unit; Coolants; Design automation; Design methodology; Design optimization; Electronics cooling; Heat sinks; Refrigeration; Temperature; Thermal resistance; Automated design; design methodology; numerical methods; optimization; thermal management;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.830969
  • Filename
    1308464