• DocumentCode
    1017831
  • Title

    Tin whiskering risk factors

  • Author

    Pinsky, David ; Osterman, Michael ; Ganesan, Sanka

  • Author_Institution
    Raytheon Co., Tewksbury, MA, USA
  • Volume
    27
  • Issue
    2
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    427
  • Lastpage
    431
  • Abstract
    Whiskers are elongated single crystals of pure tin that have been reported to grow to more than 10 mm (250 mils) in length (though they are more typically 1 mm or less) and from 0.3 to 10 μm. in diameter typical 1-3 μm). Whiskers grow spontaneously without an applied electric field or moisture (unlike dendrites) and independent of atmospheric pressure (they grow in vacuum). Whiskers may be straight, kinked, hooked, or forked and some are reported to be hollow. Their outer surfaces are usually striated. Whiskers can grow in nonfilament types which are sometimes called lumps or flowers. Whisker growth may begin soon after plating. However, initiation of growth may also take years. The unpredictable nature of whisker incubation and subsequent growth is of particular concern to systems requiring long term, reliable operation.
  • Keywords
    reliability; tin; whiskers (crystal); Sn; flowers; high-reliability products; lumps; mitigation strategies; nonfilament type; plating; reliability; risk mitigation; tin crystals; tin whiskering risk factors; whisker growth; whisker incubation; Atmospheric-pressure plasmas; Circuits; Compressive stress; Fuses; Humidity; Plasma applications; Plasma temperature; Residual stresses; Thermal stresses; Tin;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.831955
  • Filename
    1308466