DocumentCode :
1017831
Title :
Tin whiskering risk factors
Author :
Pinsky, David ; Osterman, Michael ; Ganesan, Sanka
Author_Institution :
Raytheon Co., Tewksbury, MA, USA
Volume :
27
Issue :
2
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
427
Lastpage :
431
Abstract :
Whiskers are elongated single crystals of pure tin that have been reported to grow to more than 10 mm (250 mils) in length (though they are more typically 1 mm or less) and from 0.3 to 10 μm. in diameter typical 1-3 μm). Whiskers grow spontaneously without an applied electric field or moisture (unlike dendrites) and independent of atmospheric pressure (they grow in vacuum). Whiskers may be straight, kinked, hooked, or forked and some are reported to be hollow. Their outer surfaces are usually striated. Whiskers can grow in nonfilament types which are sometimes called lumps or flowers. Whisker growth may begin soon after plating. However, initiation of growth may also take years. The unpredictable nature of whisker incubation and subsequent growth is of particular concern to systems requiring long term, reliable operation.
Keywords :
reliability; tin; whiskers (crystal); Sn; flowers; high-reliability products; lumps; mitigation strategies; nonfilament type; plating; reliability; risk mitigation; tin crystals; tin whiskering risk factors; whisker growth; whisker incubation; Atmospheric-pressure plasmas; Circuits; Compressive stress; Fuses; Humidity; Plasma applications; Plasma temperature; Residual stresses; Thermal stresses; Tin;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.831955
Filename :
1308466
Link To Document :
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