1017981

Maximum packing density and minimum size of semiconductor devices

Wallmark, J.T.

Radio Corporation of America, Sommerville, N. J.

9

1

1962

111

112

Boundary conditions; Charge carrier density; Delay lines; Diffusion processes; Fabrication; Frequency; Germanium; Impedance; Inductance; Passivation; Semiconductor devices; Silicon; Solid state circuits; Substrates; Temperature; Tuners;

English

Electron Devices, IRE Transactions on

ieee

0096-2430

jour

10.1109/T-ED.1962.14911

1473139