DocumentCode :
1018049
Title :
Chip-Scale Integration of Data-Gathering Microsystems
Author :
Lemmerhirt, David F. ; Wise, Kensall D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume :
94
Issue :
6
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
1138
Lastpage :
1159
Abstract :
Integrated microsystems merging embedded computing with sensing and actuation are poised to dramatically expand our ability to gather information from the nonelectronic world. Examples include a microassembled multichip electronic interface to the brain, an integrated electrofluidic gas chromatography system for environmental monitoring, and a wireless intra-arterial microsystem for pressure and flow measurements. In general, such microsystems will consist of a few chips, integrated in generic platforms that are customized for a given application by the sensors selected and by software. This paper illustrates this approach with a 0.15-cm/sup 3/ multisensor microsystem for autonomously sensing and storing environmental and biological data. The microsystem is formed using on-board pressure/temperature/humidity sensors, off-board strain gauges and neural/EMG electrodes, a custom sensor-interface chip, a mixed-signal microcontroller, and a nonvolatile memory. These components allow the acquisition and storage of multidomain data at low power levels (< 50 /spl mu/W reading capacitive sensors at 1 Hz). The system is programmable in gain (0.4-3.2 mV/fF), offset (10b), accuracy (14b), and sampling rate (0.1 Hz-10 kHz) and is integrated in a micromachined silicon platform that implements through-wafer interconnects, solder-based microconnectors, and recessed cavities for chip-stacking. The microsystem is realized in 9.5 mm/spl times/7.6 mm/spl times/2.0 mm (0.15 cm/sup 3/) (< 0.5 cm/sup 3/ with a lithium battery).
Keywords :
chip scale packaging; data acquisition; micromechanical devices; readout electronics; sensors; 0.1 to 10000 Hz; 2.0 mm; 9.5 mm; chip scale integration; chip-stacking; data gathering microsystems; environmental monitoring; flow measurement; integrated electrofluidic gas chromatography system; microassembled multichip electronic interface; microconnectors; microelectromechanical systems; micromachined silicon platform; mixed-signal microcontroller; multisensor microsystem; nonvolatile memory; pressure measurement; solder; system integration; through-wafer interconnects; wafer interconnects; wireless intra-arterial microsystem; Biosensors; Capacitive sensors; Embedded computing; Fluid flow measurement; Gas chromatography; Merging; Monitoring; Pressure measurement; Temperature sensors; Wireless sensor networks; Microelectromechanical systems (MEMS); microsystems; multichip integration; power management; system integration; system partitioning; through-wafer interconnects;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2006.873619
Filename :
1652902
Link To Document :
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