• DocumentCode
    1018061
  • Title

    Microsensor Integration Into Systems-on-Chip

  • Author

    Brand, Oliver

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    94
  • Issue
    6
  • fYear
    2006
  • fDate
    6/1/2006 12:00:00 AM
  • Firstpage
    1160
  • Lastpage
    1176
  • Abstract
    Sensing systems-on-chip (SSoCs), combining micromachined sensing structures and microelectronic building blocks on a single chip, are reviewed. While single-chip pressure and inertial sensing systems have been commercially available for more than a decade, the recent expansion of SSoC into new application areas, ranging from chemical and biochemical sensing to atomic force microscopy, demonstrates the full potential of this microsensor integration approach. Available fabrication processes for integrated sensing systems are summarized, categorizing them into pre-, intra-, and post-CMOS approaches depending on the way the micromachining module is merged with the integrated circuit (IC) technology. Examples of SSoCs are presented to highlight the different integration options, ranging from cointegration of micromachined sensors with purely analog signal chains to microsystems with cointegrated digital signal processors and digital interfaces.
  • Keywords
    CMOS integrated circuits; micromachining; microsensors; system-on-chip; CMOS; analog signal chains; atomic force microscopy; biochemical sensing; chemical sensing; digital interfaces; digital signal processors; fabrication processes; integrated circuit technology; integrated sensing systems; microelectronic building blocks; micromachining module; microsensor integration; microsystems; systems-on-chip; CMOS image sensors; CMOS process; CMOS technology; Fabrication; Integrated circuit technology; Magnetic sensors; Micromachining; Microsensors; System-on-a-chip; Temperature sensors; CMOS-MEMS; integrated sensor; microsensor; system-on-chip (SoC);
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2006.873618
  • Filename
    1652903