DocumentCode
1018061
Title
Microsensor Integration Into Systems-on-Chip
Author
Brand, Oliver
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
94
Issue
6
fYear
2006
fDate
6/1/2006 12:00:00 AM
Firstpage
1160
Lastpage
1176
Abstract
Sensing systems-on-chip (SSoCs), combining micromachined sensing structures and microelectronic building blocks on a single chip, are reviewed. While single-chip pressure and inertial sensing systems have been commercially available for more than a decade, the recent expansion of SSoC into new application areas, ranging from chemical and biochemical sensing to atomic force microscopy, demonstrates the full potential of this microsensor integration approach. Available fabrication processes for integrated sensing systems are summarized, categorizing them into pre-, intra-, and post-CMOS approaches depending on the way the micromachining module is merged with the integrated circuit (IC) technology. Examples of SSoCs are presented to highlight the different integration options, ranging from cointegration of micromachined sensors with purely analog signal chains to microsystems with cointegrated digital signal processors and digital interfaces.
Keywords
CMOS integrated circuits; micromachining; microsensors; system-on-chip; CMOS; analog signal chains; atomic force microscopy; biochemical sensing; chemical sensing; digital interfaces; digital signal processors; fabrication processes; integrated circuit technology; integrated sensing systems; microelectronic building blocks; micromachining module; microsensor integration; microsystems; systems-on-chip; CMOS image sensors; CMOS process; CMOS technology; Fabrication; Integrated circuit technology; Magnetic sensors; Micromachining; Microsensors; System-on-a-chip; Temperature sensors; CMOS-MEMS; integrated sensor; microsensor; system-on-chip (SoC);
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2006.873618
Filename
1652903
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