• DocumentCode
    1018071
  • Title

    SoC Issues for RF Smart Dust

  • Author

    Cook, Ben W. ; Lanzisera, Steven ; Pister, Kristofer S J

  • Author_Institution
    California Univ., Berkeley, CA, USA
  • Volume
    94
  • Issue
    6
  • fYear
    2006
  • fDate
    6/1/2006 12:00:00 AM
  • Firstpage
    1177
  • Lastpage
    1196
  • Abstract
    Wireless sensor nodes are autonomous devices incorporating sensing, power, computation, and communication into one system. Applications for large scale networks of these nodes are presented in the context of their impact on the hardware design. The demand for low unit cost and multiyear lifetimes, combined with progress in CMOS and MEMS processing, are driving development of SoC solutions for sensor nodes at the cubic centimeter scale with a minimum number of off-chip components. Here, the feasibility of a complete, cubic millimeter scale, single-chip sensor node is explored by examining practical limits on process integration and energetic cost of short-range RF communication. Autonomous cubic millimeter nodes appear within reach, but process complexity and substantial sacrifices in performance involved with a true single-chip solution establish a tradeoff between integration and assembly.
  • Keywords
    system-on-chip; wireless sensor networks; CMOS processing; MEMS processing; RF smart dust; silicon-on-chip; wireless sensor networks; wireless sensor nodes; CMOS process; Context; Costs; Hardware; Intelligent sensors; Large-scale systems; Micromechanical devices; Radio frequency; Sensor systems; Wireless sensor networks; Low-power circuits; Smart Dust; low-power RF; wireless mesh networks; wireless sensor networks; wireless sensors;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2006.873620
  • Filename
    1652904