DocumentCode
1018099
Title
Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs
Author
Patti, Robert S.
Author_Institution
Tezzaron Semicond., Naperville, IL, USA
Volume
94
Issue
6
fYear
2006
fDate
6/1/2006 12:00:00 AM
Firstpage
1214
Lastpage
1224
Abstract
Three-dimensional integrated circuits (3-D ICs) offer significant improvements over two-dimensional circuits, and promise a solution to the severe problems that are being, and will be, encountered as monolithic process geometries are reduced to below 65 nm. Several methods associated with the fabrication of 3-D ICs are discussed in this paper, and the techniques developed by Tezzaron Semiconductor Corp., are described in detail. Four successful 3-D ICs are described, along with the anticipated benefits of applying 3-D design to future system-on-chip (SoC) devices.
Keywords
integrated circuit interconnections; system-on-chip; 3D integrated circuits; integrated circuit interconnections; system-on-chip design; Capacitance; Computational geometry; Costs; Delay; Integrated circuit interconnections; Random access memory; System-on-a-chip; Three-dimensional integrated circuits; Wire; Wiring; Integrated circuit interconnections; three-dimensional integrated circuits (3-D ICs);
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2006.873612
Filename
1652906
Link To Document