• DocumentCode
    1019418
  • Title

    Rapid nondestructive thickness measurement of opaque thin films on anisotropic substrates

  • Author

    Crean, G.M. ; Waintal, A.

  • Author_Institution
    Centre National d´Etudes des Télécommunications, Meylan, France
  • Volume
    22
  • Issue
    1
  • fYear
    1986
  • Firstpage
    53
  • Lastpage
    54
  • Abstract
    A rapid, nondestructive opaque thin-film thickness measurement system is presented which takes into account the anisotropy of the sample under study and the geometry of the minature acoustic probe. Experimental results obtained using this system on W/Si (100) samples are in good agreement with those made using the Rutherford backscattering technique.
  • Keywords
    acoustic microscopy; elemental semiconductors; metallic thin films; silicon; thickness measurement; thin films; tungsten; ultrasonic materials testing; ultrasonic measurement; 100 samples; 375 MHz; US techniques; W/Si; acoustic microscopy; anisotropic substrates; miniature acoustic probe; nondestructive thickness measurement; opaque thin films; ultrasonic measurement;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19860036
  • Filename
    4256200
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1019418