Title :
Integrated LTCC Synthesizer and Signal Converter Modules at
-Band
Author :
Baras, Torben ; Jacob, Arne F.
Author_Institution :
Inst. fur Hochfrequenztech., Tech. Univ. Hamburg-Harburg, Hamburg
Abstract :
We report on fully integrated K -band synthesizer and signal converter modules. The designs are realized in low-temperature co-fired ceramics, making extensively use of the multilayer features and advanced capabilities of this substrate system. The interior packaging technology exclusively utilizes flip-chip mounting of bare semiconductors. As a key element a low phase noise synthesizer is integrated in a hermetic surface mount package of 8.7 mm times 15.8 mm, achieving an output power of more than 6 dBm in a range between 19.58-20.2 GHz. The stabilization is achieved by a fractional-N phase-locked loop, all required components being integrated inside and on top of the package. The synthesizer design is extended to dual-sideband and single-sideband converters by including mixers and couplers in the same package.
Keywords :
ceramic packaging; convertors; electric connectors; flip-chip devices; mixers (circuits); surface mount technology; bare semiconductors; couplers; dual-sideband converters; flip-chip mounting; fractional-N phase-locked loop; frequency 19.58 GHz to 20.2 GHz; hermetic surface mount package; integrated K -band synthesizer; integrated LTCC synthesizer; interior packaging technology; low-phase noise synthesizer; low-temperature co-fired ceramics; mixers; multilayer features; signal converter modules; single-sideband converters; size 8.7 mm to 15.8 mm; Frequency synthesizers; Schottky diode frequency converters; low-temperature co-fired ceramic (LTCC); voltage-controlled oscillators (VCOs);
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2008.2008940