• DocumentCode
    1020520
  • Title

    Theoretical modeling of microfabricated beams with elastically restrained supports

  • Author

    Meng, Qingyuan ; Mehregany, Mehran ; Mullen, Robert L.

  • Author_Institution
    Dept. of Civil Eng., Case Western Reserve Univ., Cleveland, OH, USA
  • Volume
    2
  • Issue
    3
  • fYear
    1993
  • fDate
    9/1/1993 12:00:00 AM
  • Firstpage
    128
  • Lastpage
    137
  • Abstract
    A mathematical model is developed to analyze the mechanical behavior of step-up supports which typically result from surface micromachining. This model accounts for the finite stiffness of the step-up support, which is more accurately represented by an elastically restrained boundary condition rather than a fixed or built-in boundary condition. Based on the model developed, the deflection of cantilever and doubly-supported beams under arbitrarily located concentrated and distributed loads is determined for a wide range of beam geometries. In addition, the buckling load of doubly-supported beams with elastically restrained boundary conditions is analyzed. Finite element analysis verifies the accuracy of the models developed. The models show that significant error in predicting the beam mechanical behavior may result if the finite stiffness of the step-up support is not correctly modeled
  • Keywords
    boundary-value problems; buckling; elasticity; finite element analysis; micromechanical devices; semiconductor device models; stress analysis; buckling load; concentrated loads; deflection of cantilever; distributed loads; doubly-supported beams; elastically restrained boundary condition; elastically restrained supports; finite element analysis; finite stiffness; load deflection; mechanical behavior; microfabricated beams; step-up supports; surface micromachining; theoretical modeling; Boundary conditions; Error correction; Finite element methods; Geometry; Mathematical model; Micromachining; Micromechanical devices; Predictive models; Solid modeling; Structural beams;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.260257
  • Filename
    260257