DocumentCode :
1020944
Title :
CMOS LSI Special Feature: CMOS LSI – Computer Component Process of the 80´s
Author :
Wollesen, Donald L.
Author_Institution :
American Microsystems, Inc.
Volume :
13
Issue :
2
fYear :
1980
Firstpage :
59
Lastpage :
67
Abstract :
Heat dissipation, or the "thermal barrier," is a problem that circuit designers have faced for years. The answer in the 1980\´s may be CMOS.
Keywords :
CMOS process; DRAM chips; Heat treatment; Large scale integration; MOS devices; Power dissipation; Temperature; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/MC.1980.1653498
Filename :
1653498
Link To Document :
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