DocumentCode
1020950
Title
Carrier-Transport-Enhanced Channel CMOS for Improved Power Consumption and Performance
Author
Takagi, Shinichi ; Iisawa, T. ; Tezuka, Tsutomu ; Numata, Toshinori ; Nakaharai, Shu ; Hirashita, Norio ; Moriyama, Yoshihiko ; Usuda, Koji ; Toyoda, Eiji ; Dissanayake, Sanjeewa ; Shichijo, Masato ; Nakane, Ryosho ; Sugahara, Satoshi ; Takenaka, Mitsuru
Author_Institution
Univ. of Tokyo, Tokyo
Volume
55
Issue
1
fYear
2008
Firstpage
21
Lastpage
39
Abstract
An effective way to reduce supply voltage and resulting power consumption without losing the circuit performance of CMOS is to use CMOS structures using high carrier mobility/velocity. In this paper, our recent approaches in realizing these carrier-transport-enhanced CMOS will be reviewed. First, the basic concept on the choice of channels for increasing on current of MOSFETs, the effective-mass engineering, is introduced from the viewpoint of both carrier velocity and surface carrier concentration under a given gate voltage. Based on this understanding, critical issues, fabrication techniques, and the device performance of MOSFETs using three types of channel materials, Si (SiGe) with uniaxial strain, Ge-on-insulator (GOI), and III-V semiconductors, are presented. As for the strained devices, the importance of uniaxial strain, as well as the combination with multigate structures, is addressed. A novel subband engineering for electrons on (110) surfaces is also introduced. As for GOI MOSFETs, the versatility of the Ge condensation technique for fabricating a variety of Ge-based devices is emphasized. In addition, as for III-V semiconductor MOSFETs, advantages and disadvantages on low effective mass are examined through simple theoretical calculations.
Keywords
CMOS integrated circuits; Ge-Si alloys; III-V semiconductors; MOSFET; low-power electronics; silicon-on-insulator; CMOS integrated circuit; III-V semiconductors; MOSFET; SiGe; carrier velocity; carrier-transport-enhanced channel; circuit performance; germanium-on-insulator; power consumption; supply voltage; surface carrier concentration; Circuit optimization; Electrons; Energy consumption; Fabrication; Germanium silicon alloys; III-V semiconductor materials; MOSFETs; Silicon germanium; Uniaxial strain; Voltage; Density-of-states (DOS); Ge; Ge-on-insulator (GOI); III–V semiconductor; effective mass; mobility; multigate MOSFET; strained Si; subband engineering; supply voltage; surface orientation; uniaxial strain; velocity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2007.911034
Filename
4408812
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