DocumentCode
1021111
Title
Performance of interconnections laid on insulating and MIS substrates
Author
Seguinot, C. ; Kennis, P. ; Pribetich, P.
Author_Institution
Université des Sciences et Techniques de Lille Flandres-Artois, Centre Hyperfréquences et Semiconducteurs, UA CNRS 287, Villeneuve d´Ascq, France
Volume
22
Issue
5
fYear
1986
Firstpage
287
Lastpage
289
Abstract
Crosstalk phenomena and pulse propagation in coupled microstrip lines are analysed. Results obtained with insulating substrates and MIS structures are compared. The method of analysis can also be applied to the modelling of Schottky contact interconnection lines. These first investigations point out the necessity to define new structures owing to the reduction of crosstalk phenomena in MMICs.
Keywords
crosstalk; metal-insulator-semiconductor structures; microwave integrated circuits; monolithic integrated circuits; strip lines; MIS substrates; MMICs; Schottky contact; coupled microstrip lines; crosstalk; insulating substrates; interconnections; pulse propagation;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19860198
Filename
4256388
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