DocumentCode
10224
Title
Wavelength Selectable Hybrid III–V/Si Laser Fabricated by Wafer Bonding
Author
Liepvre, Alban Le ; Accard, A. ; Poingt, F. ; Jany, C. ; Lamponi, Marco ; Make, Dalila ; Lelarge, F. ; Fedeli, J.-M. ; Messaoudene, S. ; Bordel, D. ; Duan, Guang-Hua
Author_Institution
III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA Leti, Palaiseau cedex, France
Volume
25
Issue
16
fYear
2013
fDate
Aug.15, 2013
Firstpage
1582
Lastpage
1585
Abstract
This letter reports on a hybrid III–V on silicon arrayed waveguide grating laser, fabricated by a wafer bonding technique. The III–V materials provide the optical gain for the laser while an arrayed waveguide grating and Bragg reflectors on silicon on insulator complete the cavity for single mode selection and laser feedback. The laser shows a threshold current
, and a maximum coupled power to a single mode fiber of
. Independent lasing of five wavelength channels spaced by 392 GHz is demonstrated.
Keywords
III-V laser; Photonic integrated circuit; hybrid laser; laser tuning; silicon-on-insulator (SOI) technology; wafer bonding;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2013.2271322
Filename
6547642
Link To Document