Title :
Lithographic processing of polymers using plasma-generated electron beams
Author :
Li, Lumin ; Krishnaswamy, Jayaram ; Yu, Zengqi ; Collins, George J. ; Hiraoka, Hiroyuki ; Caolo, Mary Ann
Author_Institution :
Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
fDate :
4/1/1990 12:00:00 AM
Abstract :
Pattern definition in polymer films is achieved using electron beams generated in soft vacuum (0.05-0.50 torr) glow discharges either on a continuous or a pulsed (20-100 ns) basis. With the continuous-mode electron beam, 7-μm transmission mask features are replicated in both polymethyl methacrylate (PMMA) and polyimide resists. Using a pulsed electron-beam submicron (~0.5 μm) features are transferred from an electron-transmitting stencil mask into the PMMA. The soft-vacuum pulsed electron beam is also eminently suited for polymer stabilization. Pulsed electron-beam hardening of 0.05-3.5 μ-thick AZ-type and MacDermid resist patterns is also demonstrated with hardened resist patterns stable to temperatures between 200° and 350°C. The demonstrated replication and pattern stabilization technique may be applicable in microelectronics packaging lithography where the resist thickness is substantial, linewidths are 1-10 μm, and registration requirements are less stringent
Keywords :
electron beam lithography; plasma applications; polymer films; 0.05 to 0.50 torr; 200 to 350 degC; 24 to 100 ns; AZ-type; MacDermid resist patterns; PMMA; continuous mode; continuous-mode; electron-transmitting stencil mask; hardened resist patterns; lithographic processing; microelectronics packaging; pattern definition; pattern stabilization; plasma-generated electron beams; polyimide resists; polymer films; polymers; pulsed mode; registration; soft vacuum; soft-vacuum pulsed electron beam; stabilization; transmission mask features; Electron beams; Glow discharges; Microelectronics; Plasma applications; Plasma materials processing; Plasma temperature; Polyimides; Polymer films; Pulse generation; Resists;
Journal_Title :
Plasma Science, IEEE Transactions on