• DocumentCode
    1025366
  • Title

    Development of internal-tin diffusion multifilamentary Nb3Sn conductors including hydrostatic extrusion

  • Author

    Xu, J.Q. ; Specking, W. ; Weiss, F. ; Flükiger, R.

  • Author_Institution
    Kernsforschungszentrum Karlsruhe, West Germany
  • Volume
    24
  • Issue
    2
  • fYear
    1988
  • fDate
    3/1/1988 12:00:00 AM
  • Firstpage
    1127
  • Lastpage
    1130
  • Abstract
    Progress is reported on the development of internal-tin-diffusion processed multifilamentary Nb3Sn wires containing (19 approximately 55) by (132 approximately 588) Nb filaments with diameters between 1 and 5 mu m. A fabrication process comprising the co-reduction of copper, niobium, tin, and the tantalum barrier to the final size by using cold hydrostatic extrusion has been established. During the whole deformation process, the workability of the wire was reported to be excellent. The present wires exhibit a homogeneous distribution of Sn cores and Nb filaments through the whole cross-section area. Data on critical current, critical temperature, and critical magnetic field are presented for different reaction conditions. At 10 T, a magnetization current density of 1.49*105A/cm2 was measured for the non-copper cross section. The present results are compared to data in the literature.
  • Keywords
    composite superconductors; critical currents; extrusion; niobium alloys; superconducting critical field; superconducting transition temperature; tin alloys; type II superconductors; 1 to 5 micron; Nb3Sn multifilamentary superconductors; critical current; critical magnetic field; critical temperature; diameters; fabrication process; hydrostatic extrusion; internal-tin diffusion; magnetization current density; workability; Copper; Critical current; Fabrication; Magnetic cores; Magnetic field measurement; Niobium; Temperature; Tin; Wires; Workability;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.11429
  • Filename
    11429