DocumentCode
1025652
Title
The new dope on semiconductor doping
Author
Paulson, Linda Dailey
Volume
37
Issue
7
fYear
2004
fDate
7/1/2004 12:00:00 AM
Firstpage
24
Abstract
A University of California, Berkeley, researcher has developed a way to apply semiconductor dopants at the atomic level. Controlling the amount of dopant applied is increasingly important as the size of wires, diodes, transistors, switches, and other semiconductor elements approaches molecular scale. During semiconductor fabrication, manufacturers typically add dopants to semiconductor materials, such as silicon, to change their performance by altering their electrical properties. P-type doping adds elements such as boron or indium to remove electrons. N-type doping inserts elements such as arsenic, phosphorous, or potassium to add electrons. Currently, chip makers frequently add dopants in bulk to semiconductor materials. However, as the elements become smaller, the amount and placement of doping must become more precise.
Keywords
semiconductor device manufacture; semiconductor doping; N-type doping; P-type doping; semiconductor doping; semiconductor fabrication; semiconductor manufacturing; semiconductor material; Electrons; Fabrication; Semiconductor device doping; Semiconductor device manufacture; Semiconductor diodes; Semiconductor materials; Silicon; Size control; Switches; Wires;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/MC.2004.61
Filename
1310235
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