• DocumentCode
    1025652
  • Title

    The new dope on semiconductor doping

  • Author

    Paulson, Linda Dailey

  • Volume
    37
  • Issue
    7
  • fYear
    2004
  • fDate
    7/1/2004 12:00:00 AM
  • Firstpage
    24
  • Abstract
    A University of California, Berkeley, researcher has developed a way to apply semiconductor dopants at the atomic level. Controlling the amount of dopant applied is increasingly important as the size of wires, diodes, transistors, switches, and other semiconductor elements approaches molecular scale. During semiconductor fabrication, manufacturers typically add dopants to semiconductor materials, such as silicon, to change their performance by altering their electrical properties. P-type doping adds elements such as boron or indium to remove electrons. N-type doping inserts elements such as arsenic, phosphorous, or potassium to add electrons. Currently, chip makers frequently add dopants in bulk to semiconductor materials. However, as the elements become smaller, the amount and placement of doping must become more precise.
  • Keywords
    semiconductor device manufacture; semiconductor doping; N-type doping; P-type doping; semiconductor doping; semiconductor fabrication; semiconductor manufacturing; semiconductor material; Electrons; Fabrication; Semiconductor device doping; Semiconductor device manufacture; Semiconductor diodes; Semiconductor materials; Silicon; Size control; Switches; Wires;
  • fLanguage
    English
  • Journal_Title
    Computer
  • Publisher
    ieee
  • ISSN
    0018-9162
  • Type

    jour

  • DOI
    10.1109/MC.2004.61
  • Filename
    1310235