DocumentCode
1026239
Title
Ferrite plating on GaAs for microwave monolithic integrated circuit
Author
Abe, M. ; Itoh, T. ; Tamaura, Y. ; Gotoh, Y. ; Gomi, M.
Author_Institution
Tokyo Institute of Technology, Tokyo, Japan
Volume
23
Issue
5
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
3736
Lastpage
3738
Abstract
Ferrite plating can potentially fabricate a ferrite non-reciprocal component on a microwave monolithick integrated circuit (MMIC); It can make crystalline spinel film in an aqueous solution below 90°C, compatible with the low heat resistance of GaAs devices. To show this, we have electro-plated or electroless-plated Fe3 O4 films on GaAs substrates. The film electroless-plated by "spray-spin-coating" method on a SiO2 intermediate layer (formed by CVD on GaAs) had a mirror plane and a strong adhesion to the surface, though limited in thickness (
m). A microstrip junction circulator has been composed of a NiZn-ferrite (Fe2.47 Ni0.28 Zn0.25 - O4 , Ms=478 emu/cc, Hc=37 Oe) film plated on a glass substrate. A circulator action has been observed at 4.0- 4.4 GHz, though very weak (0.6 dB isolation), because the ferrite film (0.8 μm) was much thinner than the substrate (500 μm). The Fe3 O4 and NiZn-ferrite films were polycrystalline with a columnar structure perpendicular to the surface. The magnetization did not exhibit anisotropy, lying in the plane of the film.
m). A microstrip junction circulator has been composed of a NiZn-ferrite (FeKeywords
Ferrite materials/devices; Gallium materials/devices; Integrated circuit fabrication; MMICs; Monolithic microwave integrated circuits (MMICs); Crystallization; Electromagnetic heating; Ferrite films; Gallium arsenide; Iron; MMICs; Microwave devices; Microwave integrated circuits; Monolithic integrated circuits; Substrates;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.1987.1065205
Filename
1065205
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