DocumentCode :
1027082
Title :
Physical CAD model for high-voltage IGBTs based on lumped-charge approach
Author :
Iannuzzo, Francesco ; Busatto, Giovanni
Author_Institution :
Dipt. di Automazione, Ind.e-Univ. degli Studi di Cassino, Italy
Volume :
19
Issue :
4
fYear :
2004
fDate :
7/1/2004 12:00:00 AM
Firstpage :
885
Lastpage :
893
Abstract :
A new insulated gate bipolar transistor (IGBT) model developed on a physical basis is presented. The Lumped-Charge method has been revised in order to point out a more general methodology for implementing the model into a circuit form. As an example, a version of the model for the popular PSPICE simulator is presented. The N-channel IGBT structure is described by means of an evolution of the PSPICE level-1 metal oxide semiconductor field effect transistor model. An accurate mobility model has been included to precisely predict the voltage drop in the ON state. Simulation results agree well with the experiments both in static and in switching operations. The comparison between the proposed and the native IGBT PSPICE model shows the better behavior of the former. The reasons for this result have been verified by means of two-dimensional MEDICI simulations. Moreover, the proposed model is able to predict the device behavior also in critical operations like its latchup during a turn-off under short-circuit conditions.
Keywords :
SPICE; circuit CAD; electric potential; insulated gate bipolar transistors; switching circuits; PSPICE simulator; high-voltage IGBT; insulated gate bipolar transistor; lumped-charge approach; metal oxide semiconductor field effect transistor; physical CAD model; short-circuit conditions; two-dimensional simulations; voltage drop; Capacitance; Electron mobility; Insulated gate bipolar transistors; Lattices; MOSFET circuits; Medical simulation; Poisson equations; Predictive models; SPICE; Voltage; 2-D; IGBT; Insulated gate bipolar transistor; Lumped-Charge method; MEDICI simulations; model; two-dimensional;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2004.830085
Filename :
1310374
Link To Document :
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