DocumentCode
1027190
Title
Thermal breakdown in silicon p-n junction devices
Author
Khurana, B.S. ; Sugano, T. ; Yanai, H.
Author_Institution
University of Tokyo, Bunkyo-ku, Tokyo, Japan
Issue
11
fYear
1966
Firstpage
763
Lastpage
770
Abstract
Current constriction in a p-n junction under a thermal mode of breakdown is analyzed and expressions for terminal voltage and radius of constriction are derived for silicon devices. The values predicted by this model are of the same order as those observed for transistors under second breakdown; it is proposed that second breakdown in transistors is a thermal mode of breakdown which inevitably follows if energy dissipated in the avalanche mode of breakdown is large enough to increase the temperature of some portion of the junction to the intrinsic or turnover temperature of the junction.
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1966.15840
Filename
1474430
Link To Document