Optimal structure for microgrooved cooling fin for high-power LSI devices

We have evaluated the relationship between the cooling capability and the channel width with a constant pressure drop for microgrooved cooling fins, and found that there are optimal channel widths which give rise to the maximum allowable power density. There are also optimal microgrooved cooling fin structures in which enlarged channel widths are sufficient to cool high-power-consumption wafer-scale integrated chips with a pressure drop of only 200 kg/m2.