Title :
Testing multichip modules
Author_Institution :
Motorola Inc., Tempe, AZ, USA
fDate :
3/1/1994 12:00:00 AM
Abstract :
Too complex to be tested as a chip and too packaged to be probed like a board, the multichip module presents a new set of challenges to the test engineer. The author describes how, until dedicated testers are developed, applying board-type tests using an IC tester will prove to be the most effective test methodology.<>
Keywords :
boundary scan testing; hybrid integrated circuits; integrated circuit testing; multichip modules; IC tester; board-type tests; boundary scan; multichip module testing; test methodology; test vectors; Automatic testing; Circuit faults; Circuit testing; Electronic equipment testing; Integrated circuit packaging; Integrated circuit testing; Military computing; Multichip modules; Pins; System testing;
Journal_Title :
Spectrum, IEEE
