DocumentCode
1029683
Title
Asymmetric, multi-conductor low-coupling structures for high-speed, high-density digital interconnects
Author
Gilb, James P K ; Balanis, Constantine A.
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume
39
Issue
12
fYear
1991
fDate
12/1/1991 12:00:00 AM
Firstpage
2100
Lastpage
2106
Abstract
Small inter-line spacings and high switching speeds emphasize the problems of crosstalk and coupling distortion in high-speed, high-density digital interconnects. The use of substrate compensation allows the design of structures in which crosstalk and coupling can be essentially eliminated, even for inter-line spacings of less than one center conductor width. Characteristics of this novel method are presented for both symmetric and asymmetric multiline geometries. Pulse distortion and crosstalk on a four-line, symmetric structure are analyzed, showing how crosstalk and coupling distortion are reduced by substrate compensation. Pulse distortion on symmetric coupled lines is studied, showing that it is possible to choose a substrate combination which significantly reduces coupling and crosstalk for a wide range of conductor configurations
Keywords
VLSI; crosstalk; digital integrated circuits; integrated circuit technology; packaging; strip lines; VLSI interconnects; asymmetric multiconductor structures; asymmetric multiline geometries; coupled microstrips; coupling distortion; crosstalk; full-wave analysis; high-density digital interconnects; high-speed; low-coupling structures; pulse distortion; substrate compensation; symmetric coupled lines; Clocks; Conductors; Crosstalk; Dielectric constant; Dielectric substrates; Frequency; Geometry; Integrated circuit interconnections; Microstrip; Very large scale integration;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.106552
Filename
106552
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