• DocumentCode
    1029683
  • Title

    Asymmetric, multi-conductor low-coupling structures for high-speed, high-density digital interconnects

  • Author

    Gilb, James P K ; Balanis, Constantine A.

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • Volume
    39
  • Issue
    12
  • fYear
    1991
  • fDate
    12/1/1991 12:00:00 AM
  • Firstpage
    2100
  • Lastpage
    2106
  • Abstract
    Small inter-line spacings and high switching speeds emphasize the problems of crosstalk and coupling distortion in high-speed, high-density digital interconnects. The use of substrate compensation allows the design of structures in which crosstalk and coupling can be essentially eliminated, even for inter-line spacings of less than one center conductor width. Characteristics of this novel method are presented for both symmetric and asymmetric multiline geometries. Pulse distortion and crosstalk on a four-line, symmetric structure are analyzed, showing how crosstalk and coupling distortion are reduced by substrate compensation. Pulse distortion on symmetric coupled lines is studied, showing that it is possible to choose a substrate combination which significantly reduces coupling and crosstalk for a wide range of conductor configurations
  • Keywords
    VLSI; crosstalk; digital integrated circuits; integrated circuit technology; packaging; strip lines; VLSI interconnects; asymmetric multiconductor structures; asymmetric multiline geometries; coupled microstrips; coupling distortion; crosstalk; full-wave analysis; high-density digital interconnects; high-speed; low-coupling structures; pulse distortion; substrate compensation; symmetric coupled lines; Clocks; Conductors; Crosstalk; Dielectric constant; Dielectric substrates; Frequency; Geometry; Integrated circuit interconnections; Microstrip; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.106552
  • Filename
    106552