• DocumentCode
    1030432
  • Title

    Enhanced Local Void and Temperature Measurements for Highly Transient Multiphase Flows

  • Author

    Schleicher, Eckhard ; Da Silva, Marco Jose ; Hampel, Uwe

  • Author_Institution
    Forschungszentrum Dresden-Rossendorf, Dresden
  • Volume
    57
  • Issue
    2
  • fYear
    2008
  • Firstpage
    401
  • Lastpage
    405
  • Abstract
    We introduce a novel combined-temperature-and-conductivity needle probe measuring system for local void fraction measurements in multiphase-flow experiments. The system is able to deal with direct sheathed microthermocouples as well as open thermocouples. It consists of a thermoneedle probe connected to a special electronic circuit using an ac measuring technique for the conductivity measurements and a high-gain instrumentation amplifier with very high common-mode rejection for the amplification of the Seebeck voltage generated by the microthermocouple. After system buildup and calibration, the system has been tested in different experiments. In a dropping experiment, the time constant of the temperature measurement of the needle probe system was determined as 3.6 ms. Additionally, steam-water and gas-steam-water flow experiments have been carried out to demonstrate the system performance.
  • Keywords
    multiphase flow; temperature measurement; thermocouples; voids (solid); Seebeck voltage; ac measuring technique; combined-temperature-and-conductivity needle probe measuring system; common-mode rejection; direct sheathed microthermocouples; electronic circuit; high-gain instrumentation amplifier; highly transient multiphase flows; local void enhancement; needle probe system; AC generators; Calibration; Circuit testing; Conductivity measurement; Electronic circuits; Instruments; Needles; Probes; Temperature measurement; Voltage; Dual modality; microthermocouple; multiphase flows; needle probe; temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2007.909470
  • Filename
    4427399