Title :
Winner: Semiconductors The Ultimate Dielectrics is ... Nothing
Abstract :
This paper presents IBM air gap technology, in which wires are placed in vacuum to speed chips and save power.
Keywords :
air gaps; isolation technology; microprocessor chips; air gap technology; dielectric isolation; microprocessor chips; Air gaps; Cable insulation; Dielectrics; Glass; Performance gain; Printed circuits; Production; Vacuum technology; Wires; Wiring;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.2008.4428312
