Title :
Wafer-chip assembly for large-scale integration
Author :
Kraynak, P. ; Fletcher, Peter
fDate :
6/1/1968 12:00:00 AM
Keywords :
Assembly; Bonding forces; Integrated circuit technology; Integrated circuit yield; Joining processes; Large scale integration; Metallization; Packaging; Silicon devices; Wafer bonding;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16270
