Title :
Fine pitch TAB technology with straight side wall bump structure for LCD panel
Author :
Takeda, Sumio ; Ezawa, Hirokazu ; Kuromaru, Akira ; Kawade, Keiichi ; Takagi, Yuichi ; Suzuki, Yasoji
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fDate :
8/1/1989 12:00:00 AM
Abstract :
A wafer-bumped TAB (tape automated bonding) device called the fine-pitch TAB device, which has been applied to a LCD (liquid crystal display) panel designed for a flat-panel display, is introduced and described. The devices, fabricated with flat-surface bumps and a straight side-wall structure instead of the conventional mushroom structure, have several important features, i.e. (1) the shear strength has an average value of 8.65×103 gr/mm2, (2) the inner lead pitch (the bump pitch) is 100 μm in the mass products, and a pitch of about 40 μm is achieved in the test vehicle. The technique utilizes a triple layer of intermediate metals consisting of titanium, nickel, and palladium, applies the bump photoengraving process using a dry-film resist, uses the cyanide electroplating technique, and uses the ILB (inner lead bonding)/OLB (outer lead bonding) equipment with higher alignment accuracy
Keywords :
flat panel displays; integrated circuit technology; lead bonding; liquid crystal displays; 100 micron; 40 micron; LCD panel; bump photoengraving process; bump pitch; cyanide electroplating technique; dry-film resist; fine pitch TAB technology; fine-pitch TAB; flat-panel display; flat-surface bumps; inner lead bonding; inner lead pitch; intermediate metals; liquid crystal display; outer lead bonding; shear strength; straight side wall bump structure; tape automated bonding; test vehicle; wafer bumped TAB device; Application specific integrated circuits; Assembly; Electronics packaging; Integrated circuit packaging; Liquid crystal displays; Nickel; Pins; Testing; Wafer bonding; Wire;
Journal_Title :
Consumer Electronics, IEEE Transactions on
