Title :
The laminated overlay transistor, a new approach to high-power-high frequency structures
fDate :
6/1/1968 12:00:00 AM
Keywords :
Boron; Electric breakdown; Electronic packaging thermal management; Etching; Frequency; Insertion loss; Low voltage; Plasma temperature; Power system protection; Thermal resistance;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16360
