High-pitch metal-on-glass technology for pad pitch adaptation between detectors and readout electronics

Modern high-energy physics and astrophysics strip detectors have increased channel density to levels at which their connection with readout electronics has become very complex due to high pad pitch. Also, direct wire bonding is prevented by the fact that typically detector´s pad pitch and electronics´ pad pitch do not match. A high-pitch metal-on-glass technology is presented, that allows pad pitch adaptation between detectors and readout electronics. It consists of high-density metal lines on top of an insulating glass substrate. A photoresist layer is deposited covering the metal tracks for passivation and protection The technology is tested for conductivity, bondability, bonding pull force, peel off, and radiation hardness, and it is an established technology in the clean room of the CNM Institute in Barcelona. This technology has been chosen by the ATLAS Collaboration for the pad pitch adapters (PPA) of the SCT Endcap Modules, by a Compton camera project, and by other HEP groups for interconnection between detectors and readout electronics.