The Fabrication of Vertical Light-Emitting Diodes Using Chemical Lift-Off Process

Author

Ha, Jun-Seok ; Lee, S.W. ; Lee, Hyun-Jae ; Lee, Hyo-Jong ; Lee, S.H. ; Goto, H. ; Kato, T. ; Fujii, Katsushi ; Cho, M.W. ; Yao, T.

Author_Institution

Tohoku Univ., Sendai

Volume

20

Issue

3

fYear

2008

Firstpage

175

Lastpage

177

Abstract

Vertical light-emitting diodes (LEDs) were successfully fabricated by a chemical lift-off process using a selectively etchable CrN buffer layer. The novel CrN metallic layer worked well as a buffer layer for growth of the GaN LED and was etched out clearly during selective chemical etching. The vertical LED by chemical lift-off showed very good current-voltage performance with low series resistance of 0.65 Omega and low operated voltage of 3.11 V at 350 mA. Also, this device could be operated at a much higher injection forward current (1118 mA at 3.70 V) by thermally conductive metal substrate which enabled the high current operation with excellent heat dissipation.

Keywords

III-V semiconductors; buffer layers; chromium compounds; etching; gallium compounds; light emitting diodes; optical fabrication; wide band gap semiconductors; GaN; GaN-CrN; LED; chemical lift-off process; current 1118 mA; current 350 mA; current-voltage performance; heat dissipation; injection forward current; metallic layer; selective chemical etching; selectively etchable buffer layer; series resistance; thermally conductive metal substrate; vertical light-emitting diodes; voltage 3.11 V; voltage 3.70 V; Buffer layers; Chemical processes; Electrostatic discharge; Etching; Fabrication; Gallium nitride; Light emitting diodes; Photonic crystals; Temperature; Thermal conductivity; Chemical lift-off; CrN buffer; GaN; light-emitting diodes (LEDs); vertical light-emitting diode (LED);

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2007.912491

Filename

4429333