DocumentCode :
10335
Title :
Influence of Implantation Damages and Intrinsic Dislocations on Phosphorus Diffusion in Ge
Author :
Yujiao Ruan ; Chengzhao Chen ; Shihao Huang ; Wei Huang ; Songyan Chen ; Cheng Li ; Jun Li
Author_Institution :
Dept. of Phys., Xiamen Univ., Xiamen, China
Volume :
60
Issue :
11
fYear :
2013
fDate :
Nov. 2013
Firstpage :
3741
Lastpage :
3745
Abstract :
Influence of the implant-induced damages and the threading dislocations during germanium (Ge) epitaxy was investigated on the phosphorus diffusion in Ge. An adequate n-type junction was formed by 650°C rapid thermal annealing of the implanted bulk Ge. It is observed that for epitaxial Ge on Si substrate, there was an enhanced local phosphorus diffusion approaching the Ge/Si interface. A diffusion model considering the enhancement by defects is proposed to sufficiently explain the phosphorus diffusion profiles in Ge. The intrinsic dislocation-enhanced phosphorus diffusivity found at least three orders of magnitude larger than that in the absence of dislocations.
Keywords :
diffusion; dislocations; elemental semiconductors; germanium; ion implantation; phosphorus; rapid thermal annealing; semiconductor doping; semiconductor epitaxial layers; Si; Si substrate; Si-Ge:P; diffusion model; germanium epitaxy; implantation damages; intrinsic dislocations; n-type junction; phosphorus diffusion; rapid thermal annealing; threading dislocations; Annealing; Epitaxial growth; Germanium; Semiconductor process modeling; Substrates; Germanium (Ge); implantation damage; phosphorus diffusion; threading dislocation;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2280382
Filename :
6600887
Link To Document :
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