A 140 Mbit/s CMOS LSI framer chip for a broad-band ISDN local access system

Author

Chao, H. Jonathan ; Robe, Thomas J. ; Smoot, Lanny S.

Author_Institution

Bell Commun. Res. Inc., Morristown, NJ, USA

Volume

23

Issue

1

fYear

1988

fDate

2/1/1988 12:00:00 AM

Firstpage

133

Lastpage

141

Abstract

A LSI framer chip, which provides a SONET-like time-division-multiplexed frame structure and which has been implemented in a production 2-μm CMOS technology, is described. Current samples of the chip have been tested functional to 160 Mb/s. The primary attributes presented include the circuit features used to achieve high-bit-rate operation, the level translation circuits which afford direct interfacing to ECL level clock and data signals, and the functional capabilities which lead to broad application of the chip in communications networks. Several examples of its use in a prototype broadband local access network are also described. The ship operates from a single 5-V supply, dissipates approximately 420 mW, and is packaged in a 68-pin leadless ceramic chip carrier (LCCC) package

Keywords

CMOS integrated circuits; ISDN; broadband networks; digital communication systems; digital integrated circuits; integrated logic circuits; large scale integration; multiplexing equipment; time division multiplexing; 140 to 160 Mbit/s; 2 micron; 420 mW; 5 V; 68 pin LCCC package; CMOS; ECL level clock signals; ECL level data signals; ISDN; LSI framer chip; SONET-like; TDM; broadband local access network; communications networks; digital IC; direct interfacing; high-bit-rate operation; leadless ceramic chip carrier; level translation circuits; single 5-V supply; time-division-multiplexed frame structure; B-ISDN; CMOS technology; Circuit testing; Clocks; Communication networks; ISDN; Large scale integration; Packaging; Production; Prototypes;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/4.269

Filename

269