DocumentCode
1035421
Title
Thermal impedance of ceramic packages using beam-lead IC chips
Author
Hardwick, N.E.
Volume
16
Issue
2
fYear
1969
fDate
2/1/1969 12:00:00 AM
Firstpage
247
Lastpage
247
Keywords
Ceramics; Computer graphics; Dielectric breakdown; Dielectric losses; Impedance; Integrated circuit packaging; Silicon; Substrates; Surface resistance; Thermal resistance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1969.16675
Filename
1475717
Link To Document