Title :
A new wide-band input compensation for packaged analog and digital multigigabit IC´s
Author :
Hageraats, Hans ; Hooijmans, Pieter W. ; Tomesen, Mark T.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
fDate :
1/1/1994 12:00:00 AM
Abstract :
Packaging of multigigabit IC´s introduces an input series inductance due to the bondwire which has a dominant influence on the overall IC performance. This paper describes the design and implementation of a novel input compensation circuit that both reduces the effects of the series inductance and offers the possibility to use an external termination with different impedances. Furthermore, a detailed theoretical investigation into the performance of the circuit is presented. A 7.4 Gb/s D-type flip-flop and a 4.2-GHz, 35-dB gain amplifier have been realized in a commercial 1-μm silicon bipolar IC process with an average fT of 11 GHz, showing the good performance of the input circuit
Keywords :
amplifiers; bipolar integrated circuits; buffer circuits; compensation; flip-flops; inductance; linear integrated circuits; packaging; 1 mum; 11 GHz; 35 dB; 4.2 GHz; 7.4 Gbit/s; AGC amplifier; D-type flip-flop; S-parameters; bipolar IC process; bondwire; design methodology; emitter follower input buffer; external termination; high-speed IC interconnections; input buffer stage; input series inductance; negative input impedance compensation; packaged multigigabit ICs; wideband input compensation; Analog integrated circuits; Bonding; Digital integrated circuits; Frequency; Impedance; Inductance; Packaging; Resistors; Wideband; Wire;
Journal_Title :
Solid-State Circuits, IEEE Journal of
