Title :
Cryotron substrate interconnection techniques
Author_Institution :
Arthur D. Little, Inc., Cambridge, MA
fDate :
9/1/1967 12:00:00 AM
Keywords :
Superconducting devices; Transformers; Bonding; Circuit testing; Glass; Integrated circuit interconnections; Pulse amplifiers; Substrates; Superconductivity; Temperature; Thermal conductivity; Thickness control;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.1967.1066102
