Title :
Connection of VLSI chips to printed circuit board using stacked solder bumps
Author :
Sasaki, Seishi ; Kishimoto, T. ; Matsui, Nobuyuki
Author_Institution :
NTT, Electrical Communications Laboratories, Musashino, Japan
Abstract :
A new type of flip-chip interconnection technology usingstacked solder bumps is proposed, where the diameter of theupper solder bump is less than that of the lower ones. This isto reduce the capacitance between the stacked solder bumps and the ground plane and to prolong the lifetime ofthe solder joints.
Keywords :
VLSI; flip-chip devices; printed circuits; soldering; surface mount technology; capacitance; flip-chip interconnection technology; ground plane; printed circuit board; solder joints; stacked solder bumps;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19870862
