DocumentCode
1037865
Title
Connection of VLSI chips to printed circuit board using stacked solder bumps
Author
Sasaki, Seishi ; Kishimoto, T. ; Matsui, Nobuyuki
Author_Institution
NTT, Electrical Communications Laboratories, Musashino, Japan
Volume
23
Issue
23
fYear
1987
Firstpage
1238
Lastpage
1240
Abstract
A new type of flip-chip interconnection technology usingstacked solder bumps is proposed, where the diameter of theupper solder bump is less than that of the lower ones. This isto reduce the capacitance between the stacked solder bumps and the ground plane and to prolong the lifetime ofthe solder joints.
Keywords
VLSI; flip-chip devices; printed circuits; soldering; surface mount technology; capacitance; flip-chip interconnection technology; ground plane; printed circuit board; solder joints; stacked solder bumps;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19870862
Filename
4259102
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