• DocumentCode
    103829
  • Title

    Integrated Powder-Based Thick Films for Thermoelectric, Pyroelectric, and Piezoelectric Energy Harvesting Devices

  • Author

    Dorey, Robert A.

  • Author_Institution
    Univ. of Surrey, Guildford, UK
  • Volume
    14
  • Issue
    7
  • fYear
    2014
  • fDate
    Jul-14
  • Firstpage
    2177
  • Lastpage
    2184
  • Abstract
    Energy harvesting devices based on piezoelectric, pyroelectric, and thermoelectric materials offer an attractive solution for batteryless and wireless sensor nodes for a range of sensor applications. Current devices are typically fabricated using semimanual approaches leading to higher costs and reduced yields as well as significant material wastage. Powder-based thick film devices have been shown to be capable of harvesting milliwatt levels of power while the associated printing technologies offer commercially attractive fabrication solutions. This paper provides a review of examples of recent piezoelectric, pyroelectric, and thermoelectric powder-based thick film energy harvester devices and outlines potential fabrication techniques, ink compositions, and ways to reduce processing temperatures that can be used to create integrated thick film energy harvesting devices. The key to the creation of such devices is the management of thermal budgets and processing environments to ensure the functional properties of the thick films are maximized.
  • Keywords
    energy harvesting; piezoelectric transducers; pyroelectric devices; thermal management (packaging); thermoelectric devices; thick film devices; fabrication techniques; ink compositions; integrated powder-based thick films; piezoelectric energy harvesting devices; processing temperature reduction; pyroelectric energy harvesting devices; thermal budget management; thermoelectric energy harvesting devices; Ink; Powders; Printing; Substrates; Thick films; Energy harvesting; environmentally friendly manufacturing techniques; materials processing; piezoelectric devices; thermoelectric devices; thick film devices;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2014.2306443
  • Filename
    6740815