Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining

Author

Bang, Christopher A. ; Rice, Joseph P. ; Flik, Markus I. ; Rudman, David A. ; Schmidt, Martin A.

Author_Institution

Dept. of Mech. Eng., MIT, Cambridge, MA, USA

Volume

2

Issue

4

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

160

Lastpage

164

Abstract

Using a new micromachining technology, thermally isolated thin films of high-temperature superconductor have been microfabricated. The intended application for these structures is in infrared bolometers. A silicon wafer bonding process produces a low thermal mass island of single-crystal silicon on a silicon nitride membrane which provides thermal isolation. The silicon can act as a seed for the epitaxial growth of YBa₂Cu₃O₇ on a yttria-stabilized zirconia buffer layer. This paper describes the overall concept of the thermally isolated device, and demonstrates that the micromachined structure can be fabricated with high-quality superconducting films

Keywords

bolometers; high-temperature superconductors; microassembling; micromechanical devices; silicon; superconducting thin films; wafer bonding; IR bolometers; Si; Si₃N₄ membrane; YBa₂Cu₃O₇; epitaxial growth; high-quality superconducting films; high-temperature superconducting thin films; infrared bolometers; low thermal mass island; micromachining; micromachining technology; silicon nitride membrane; silicon wafer bonding; silicon wafer bonding process; single-crystal silicon; thermal isolation; thermally isolated thin films; yttria-stabilized zirconia buffer layer; Biomembranes; Bolometers; Buffer layers; Epitaxial growth; High temperature superconductors; Isolation technology; Micromachining; Silicon; Superconducting thin films; Wafer bonding;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.273092

Filename

273092