DocumentCode :
1039355
Title :
The yield enhancement of field-programmable gate arrays
Author :
Howard, Neil J. ; Tyrrell, Andrew M. ; Allinson, Nigel M.
Author_Institution :
Dept. of Electron., York Univ., UK
Volume :
2
Issue :
1
fYear :
1994
fDate :
3/1/1994 12:00:00 AM
Firstpage :
115
Lastpage :
123
Abstract :
The fine granularity and reconfigurable nature of field-programmable gate arrays (FPGA´s) suggest that defect-tolerant methods can be readily applied to these devices in order to increase their maximum economic sizes, through increased yield. This paper identifies the inability to contain faults within single cells and the need for fast reconfiguration as the key obstacles to obtaining a significant increase in yield. Monte Carlo defect modeling of the photolithographic layers of VLSI FPGA´s is used as a foundation for the yield modeling of various defect-tolerant architectures. Results suggest that a medium-grain architecture is the best solution, offering a substantial increase in size without significant side effects. This architecture is shown to produce greater gate densities than the alternative approach of realizing ultralarge scale FPGA´s-multichip modules.<>
Keywords :
Monte Carlo methods; VLSI; circuit layout; circuit reliability; logic arrays; logic design; logic testing; multichip modules; network routing; redundancy; semiconductor device models; Monte Carlo defect modeling; VLSI FPGA; defect-tolerant architectures; defect-tolerant methods; fast reconfiguration; field-programmable gate arrays; gate densities; medium-grain architecture; multichip modules; photolithographic layers; ultralarge scale FPGA MCM; yield enhancement; yield modeling; Circuit faults; Fabrication; Fault diagnosis; Field programmable gate arrays; Fuses; Monte Carlo methods; Programmable logic arrays; Redundancy; Routing; Very large scale integration;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/92.273147
Filename :
273147
Link To Document :
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