Title :
An analysis of the heat pipe as a heat sink for solid-state RF sources
fDate :
11/1/1970 12:00:00 AM
Abstract :
Equations are developed for determining the temperature of a steady-state power flux source incident on the heat pipe as a function of the pipe wall thickness. The analysis shows the heat pipe to be no better than a semi-infinite heat sink operating at an elevated temperature for practical solid-state RF devices having power flux densities of 104-106watts/cm2.
Keywords :
Geometry; Gravity; Heat sinks; Heat transfer; Isothermal processes; Radio frequency; Solid state circuits; Steady-state; Temperature distribution; Thermal conductivity;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1970.17117