DocumentCode
1040392
Title
Initial and radiation-induced charge distribution in silicon oxynitride MIS structures
Author
Ashner, J.D.
Volume
18
Issue
6
fYear
1971
fDate
6/1/1971 12:00:00 AM
Firstpage
384
Lastpage
386
Abstract
Silicon oxynitride films deposited on a HF-etched Si surface show a large fixed positive charge in the dielectric (2-3 × 10-2cm-2). This charge is shown by etch-back experiments to be located near the silicon-oxynitride interface. Negative charge is injected into the oxynitride film if a negative bias larger than 2.8 × 105V/cm is applied during irradiation. For saturation doses (about 1-2 Mrad of absorbed radiation), the magnitude of the injected charge can become as large or larger than the original positive charge in the oxynitride. The injected negative charge, is shown to be located at the silicon-oxynitride interface by etch-back experiments. The injection of negative charge under the above conditions appears to be an electronic phenomenon. An ionic mechanism appears unlikely because re-irradiation at room temperature without application of a bias restores the original flat-band condition of the MIS capacitor.
Keywords
Capacitance-voltage characteristics; Conductive films; Conductivity; Dielectric thin films; Etching; Semiconductor films; Silicon; Stability; Stress; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1971.17206
Filename
1476528
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