Plastic packaged microcircuits: quality, reliability, and cost issues

Author

Pecht, Michael G. ; Agarwal, Rakesh ; Quearry, D.

Author_Institution

CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA

Volume

42

Issue

4

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

513

Lastpage

517

Abstract

Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEMs in cost, size, weight, performance, and market lead-time, have attracted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applications due to the perception that PEM reliability is low. This work surveys plastic packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part selection and system design

Keywords

circuit reliability; economics; integrated circuits; packaging; plastics; application; cost; market lead-time; microcircuits; packaging; part selection; performance; plastic encapsulation; quality; reliability; system design; weight; Ceramics; Consumer electronics; Costs; Electronics packaging; Integrated circuit interconnections; Manufacturing; Marketing and sales; Military communication; Plastic packaging; US Government;

fLanguage

English

Journal_Title

Reliability, IEEE Transactions on

Publisher

ieee

ISSN

0018-9529

Type

jour

DOI

10.1109/24.273569

Filename

273569