Title :
Molding compound trends in a denser packaging world: qualification tests and reliability concerns
Author :
Nguyen, L.T. ; Lo, R.H.Y. ; Chen, A.S. ; Belani, J.G.
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
fDate :
12/1/1993 12:00:00 AM
Abstract :
This work benchmarks the current reliability tests used by the electronics industry, examines those tests that affect and are affected by molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability; package stresses; package cracking; halogen-induced intermetallic growth at bond pads; moisture-induced corrosion; and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended
Keywords :
circuit reliability; failure analysis; integrated circuit testing; life testing; packaging; accelerated testing; bond pads; development; electronics industry; interfacial delamination; intermetallic growth; moisture-induced corrosion; molding compounds; package cracking; package stresses; packaging world; qualification tests; reliability; Benchmark testing; Bonding; Corrosion; Electronic equipment testing; Electronics industry; Electronics packaging; Intermetallic; Life estimation; Qualifications; Stress;
Journal_Title :
Reliability, IEEE Transactions on
