Title :
High performance optical datalink array technology
Author :
Nordin, Ronald A. ; Buchholz, D. Bruce ; Huisman, Roger F. ; Basavanhally, Nagesh R. ; Levi, Anthony F J
Author_Institution :
AT&T Bell Labs., Naperville, IL, USA
fDate :
12/1/1993 12:00:00 AM
Abstract :
Demands for increased interconnection density and higher bandwidth, coupled with the stringent cost constraints of advanced wide-bandwidth telecommunication switching and high-throughput computer architectures, are exhausting conventional electrical interconnection capabilities. Presently, a bottleneck occurs at the board-to-board level of the interconnection hierarchy. A parallel optical interconnection technique called the one-dimensional optical data link (1D-ODL) is proposed to address this problem. It can be incorporated into system designs beginning at this interconnection level and beyond. The strategic insertion of parallel optical interconnection technology into these electronic processing systems not only meets projected performance requirements, but potentially offers them at a competitive cost
Keywords :
data communication equipment; optical communication equipment; optical fibres; optical interconnections; optical links; packaging; interconnection density; one-dimensional optical data link; optical datalink array technology; parallel optical interconnection technique; Bandwidth; Connectors; Costs; Integrated circuit interconnections; Optical arrays; Optical fibers; Optical interconnections; Optical receivers; Optical transmitters; Semiconductor laser arrays;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on