• DocumentCode
    1042766
  • Title

    High performance optical datalink array technology

  • Author

    Nordin, Ronald A. ; Buchholz, D. Bruce ; Huisman, Roger F. ; Basavanhally, Nagesh R. ; Levi, Anthony F J

  • Author_Institution
    AT&T Bell Labs., Naperville, IL, USA
  • Volume
    16
  • Issue
    8
  • fYear
    1993
  • fDate
    12/1/1993 12:00:00 AM
  • Firstpage
    783
  • Lastpage
    788
  • Abstract
    Demands for increased interconnection density and higher bandwidth, coupled with the stringent cost constraints of advanced wide-bandwidth telecommunication switching and high-throughput computer architectures, are exhausting conventional electrical interconnection capabilities. Presently, a bottleneck occurs at the board-to-board level of the interconnection hierarchy. A parallel optical interconnection technique called the one-dimensional optical data link (1D-ODL) is proposed to address this problem. It can be incorporated into system designs beginning at this interconnection level and beyond. The strategic insertion of parallel optical interconnection technology into these electronic processing systems not only meets projected performance requirements, but potentially offers them at a competitive cost
  • Keywords
    data communication equipment; optical communication equipment; optical fibres; optical interconnections; optical links; packaging; interconnection density; one-dimensional optical data link; optical datalink array technology; parallel optical interconnection technique; Bandwidth; Connectors; Costs; Integrated circuit interconnections; Optical arrays; Optical fibers; Optical interconnections; Optical receivers; Optical transmitters; Semiconductor laser arrays;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.273674
  • Filename
    273674