• DocumentCode
    1042873
  • Title

    Electrical, structural and processing properties of electrically conductive adhesives

  • Author

    Li, Li ; Lizzul, Christine ; Kim, Hansoo ; Sacolick, Isaac ; Morris, James E.

  • Author_Institution
    Dept. of Electr. Eng., Binghamton Univ., NY, USA
  • Volume
    16
  • Issue
    8
  • fYear
    1993
  • fDate
    12/1/1993 12:00:00 AM
  • Firstpage
    843
  • Lastpage
    851
  • Abstract
    There is growing interest in the potential of electrically conductive metal-loaded polymer adhesives. Eight commercial electrically conductive adhesive pastes for solder replacement in surface mount technology (SMT) and other microelectronic applications were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite. The properties on which this work was focused were the microstructure and electrical characteristics, with the specific purpose of determining the conduction mechanisms. The electrical measurements established that the primary source of electrical resistance is in the silver particles, with negligible contact effects between them. Differential scanning calorimetry results indicated that drifts in the electrical properties are not attributable to incomplete cures. Electrical measurements on simplified structures prepared in the laboratory are also reported
  • Keywords
    adhesion; conducting polymers; electrical conductivity of solids; filled polymers; microassembling; nickel; percolation; silver; surface mount technology; thermal analysis; Ag; Ag particles; Ag-polymer composite; Ni; Ni-polymer composite; SMT; adhesive pastes; conduction mechanisms; differential scanning calorimetry; electrical characteristics; electrical resistance; electrically conductive adhesives; metal-loaded polymer adhesives; microelectronic applications; microstructure; processing properties; solder replacement; structural properties; surface mount technology; thermoplastic type; thermosetting type; Conductive adhesives; Electric potential; Electric variables measurement; Electrical resistance measurement; Mechanical factors; Microelectronics; Microstructure; Polymers; Silver; Surface-mount technology;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.273683
  • Filename
    273683