Title :
Encapsulants used in flip-chip packages
Author :
Suryanarayana, Darbha ; Wu, Tien Y. ; Varcoe, Jack A.
Author_Institution :
Microelectron. Div., IBM Corp., Endicott, NY, USA
fDate :
12/1/1993 12:00:00 AM
Abstract :
A systematic approach to quantifying the viscosity and flow coverage, thermal expansion, modulus, glass transition temperature, filler size, alpha activity, adhesion, ionics content, fracture toughness, and electrical properties of low-thermal-expansion encapsulants is presented. The various test methods and their relevant technical aspects are discussed. Results achieved on a few selected materials are presented as examples
Keywords :
adhesion; encapsulation; flip-chip devices; fracture toughness; moisture; packaging; thermal expansion; viscosity of liquids; adhesion; alpha activity; electrical properties; filler size; flip-chip packages; flow coverage; fracture toughness; glass transition temperature,; ionics content; low-thermal-expansion encapsulants; modulus; test methods; thermal expansion; viscosity; Adhesives; Bonding; Ceramics; Electronic packaging thermal management; Electronics packaging; Fatigue; Glass; Thermal expansion; Thermal stresses; Viscosity;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
