Title :
Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)
Author :
Wang, David W. ; Papathomas, Kostas I.
Author_Institution :
Endicott Electron. Packaging Technol. Products, IBM Corp., Endicott, NY, USA
fDate :
12/1/1993 12:00:00 AM
Abstract :
The characterization of a liquid silica-filled system for maximum processability of controlled-collapse chip connection (C4), or flip-chip connection, chips is described. Critical thermomechanical properties were studied to ensure that both ceramic module and card assembly conditions can be sustained. Both rheological properties and cure kinetics were optimized to provide enhanced flow and coverage of the C4s. Other key properties, such as shelf life, thermal stability, solvent and moisture resistance, and adhesion to various surfaces, are addressed
Keywords :
adhesion; encapsulation; fatigue; filled polymers; flip-chip devices; moisture; stability; surface mount technology; thermal expansion; adhesion; card assembly conditions; ceramic module assembly conditions; controlled-collapse chip connection; fatigue life enhancement; filled epoxy resin; flip-chip connection; liquid silica-filled system; moisture resistance; packaging; rheological properties; shelf life; solvent resistance; thermal stability; thermomechanical properties; Assembly; Ceramics; Control systems; Fatigue; Kinetic theory; Process control; Rheology; Surface resistance; Thermal resistance; Thermomechanical processes;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
