Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

Author

Wang, David W. ; Papathomas, Kostas I.

Author_Institution

Endicott Electron. Packaging Technol. Products, IBM Corp., Endicott, NY, USA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

863

Lastpage

867

Abstract

The characterization of a liquid silica-filled system for maximum processability of controlled-collapse chip connection (C4), or flip-chip connection, chips is described. Critical thermomechanical properties were studied to ensure that both ceramic module and card assembly conditions can be sustained. Both rheological properties and cure kinetics were optimized to provide enhanced flow and coverage of the C4s. Other key properties, such as shelf life, thermal stability, solvent and moisture resistance, and adhesion to various surfaces, are addressed

Keywords

adhesion; encapsulation; fatigue; filled polymers; flip-chip devices; moisture; stability; surface mount technology; thermal expansion; adhesion; card assembly conditions; ceramic module assembly conditions; controlled-collapse chip connection; fatigue life enhancement; filled epoxy resin; flip-chip connection; liquid silica-filled system; moisture resistance; packaging; rheological properties; shelf life; solvent resistance; thermal stability; thermomechanical properties; Assembly; Ceramics; Control systems; Fatigue; Kinetic theory; Process control; Rheology; Surface resistance; Thermal resistance; Thermomechanical processes;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273686

Filename

273686