Title :
Aluminum conductor failure due to thermal expansion by power pulses
Author :
Mimura, Takashi ; Fukuta, Masumi ; Matayoshi, Hirokazu
Author_Institution :
Fujitsu Limited, Kobe, Japan
fDate :
5/1/1972 12:00:00 AM
Abstract :
It is found that an aluminum conductor can fail due to a thermal stress caused by periodically applying rectangular power pulses to semiconducting devices that generate heat internally. The mean time to failure due to this process is calculated. The agreement between the calculated values and the experimental data is good.
Keywords :
Aluminum; Artificial intelligence; Conducting materials; Conductive films; Conductors; Semiconductivity; Semiconductor films; Temperature; Thermal conductivity; Thermal expansion;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1972.17481
