• DocumentCode
    1044238
  • Title

    BCB-based wafer-level packaged single-crystal silicon multi-port RF MEMS switch

  • Author

    Kim, J.-M. ; Lee, S. ; Baek, C.-W. ; Kwon, Y. ; Kim, Y.K.

  • Author_Institution
    Seoul Nat. Univ., Seoul
  • Volume
    44
  • Issue
    2
  • fYear
    2008
  • Firstpage
    118
  • Lastpage
    119
  • Abstract
    A fully wafer-level packaged single-crystal silicon single-pole nine- throw (SP9T) MEMS switch using benzocyclobutene as a packaging adhesive layer is presented. The packaged switch shows an insertion loss of less than 0.6 dB and an average packaging loss of 0.04 dB, and an input to output isolation of better than 35 dB for all of the measured paths with little deviations up to 2 GHz.
  • Keywords
    adhesives; microswitches; wafer level packaging; BCB-based wafer-level packaging; RF MEMS switch; benzocyclobutene; microswitches; packaging adhesive layer; single-crystal silicon; single-pole nine-throw MEMS switch;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20083288
  • Filename
    4436149
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1044238