DocumentCode :
1044485
Title :
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
Volume :
30
Issue :
2
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2007.902906
Filename :
4265764
Link To Document :
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